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Article published on Ultrasonic Additive Manufacturing as a process for embedding electronic circuitry into a metal matrix

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Ultrasonic Additive Manufacturing as a form-then-bond process for embedding electronic circuitry into a metal matrix

Journal of Manufacturing Processes,Volume 32, April 2018, Pages 664–675

Alkaios Bournias-Varotsis, Ross J. Friel, Russell A. Harris, Daniel S. Engstrøm