Publications
Journal articles
2022
T. Monaghan, M. J. Harding, S. D. R. Christie, R. A. Harris & R. J. Friel. 2022. Complementary catalysis and analysis within solid state additively manufactured metal micro flow reactors. Sci Rep.
2021
2021. Residual polymer stabiliser causes anisotropic electrical conductivity during inkjet printing of metal nanoparticles. Communications Materials. 2.1 
2021. Broadband negative-index surface-waves on arrays of capped helices. Physical Review Research. 3.4
2021. 3D Printing of Dapagliflozin Containing Self-Nanoemulsifying Tablets: Formulation Design and In Vitro Characterization. Pharmaceutics. 13.7
2021. Digitally Driven Aerosol Jet Printing to Enable Customisable Neuronal Guidance. Frontiers in Cell and Developmental Biology. 9
2021. Is in-vivo sensing in a total hip replacement a possibility? A review on past systems and future challenges.. Progress in Biomedical Engineering.
2020
2020. A Novel Computer-Controlled Maskless Fabrication Process for Pneumatic Soft Actuators. Actuators. 9(4)
2020. Light based synthesis of metallic nanoparticles on surface-modified 3D printed substrates for high performance electronic systems. Additive Manufacturing. 34
Da Veiga T, Chandler JH, Lloyd P, Pittiglio G, Wilkinson NJ, Hoshiar AK,
2020. A Novel Computer-Controlled Maskless Fabrication Process for Pneumatic Soft Actuators. Actuators. 9(4), pp. 136-136
Lee J, Varagnolo S, Walker M, Hatton RA. Transparent Fused Nanowire Electrodes by Condensation Coefficient Modulation. 2020. Advanced Functional Materials
Esfahani RN, Shuttleworth MP, Doychinov V, Wilkinson NJ, Hinton J, Jones TDA, Ryspayeva A, Robertson ID, Marques-Hueso J, Desmulliez MPY. 2020. Light based synthesis of metallic nanoparticles on surface-modified 3D printed substrates for high performance electronic systems. Additive Manufacturing Article number 101367
Algahtani MS, Mohammed AA, Ahmad J, Development of a 3D Printed Coating Shell to Control the Drug Release of Encapsulated Immediate-Release Tablets. Polymers 2020, 12 (6)
Wilkinson NJ, Kay RW, Harris RA. 2020. Electrohydrodynamic and Aerosol Jet Printing for the Copatterning of Polydimethylsiloxane and Graphene Platelet Inks. Advanced Materials Technologies. 2000148
2020. Spinach-based photo-catalyst for selective plating on polyimide-based substrates for micro-patterning circuitry. Chemical Engineering Research and Design. 839-848 153
2020. Selective deposition of silver and copper films by condensation coefficient modulation. Materials Horizons. 7(1), pp. 143-148
2019
Wilkinson NJ, Smith MAA, Kay RW, Harris RA. 2019. A review of aerosol jet printing—a non-traditional hybrid process for micro-manufacturing. International Journal of Advanced Manufacturing Technology. 4599-4619 105.11
2019. Ultrasonic additive manufacturing using feedstock with build-in circuitry for 3D metal embedded electronics. Additive Manufacturing. 29
2019. Selective Electroless Copper Deposition by Using Photolithographic Polymer/Ag Nanocomposite. IEEE Transactions on Electron Devices. 1843-1848 66.4
2019. Mechanical behaviour of additively manufactured lunar regolith simulant components. Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications. 1629-1644 233.8
2019. Hybrid additive manufacturing of precision engineered ceramic components. Rapid Prototyping Journal. 1061-1068 25.6
2019. Extreme environment interconnects and packaging for power electronics. Journal of Engineering. 4226-4230 2019.17
2019. Selective Electroless Copper Deposition by Using Photolithographic Polymer/Ag Nanocomposite. IEEE Transactions on Electron Devices. 1843-1848 66.4
2019. A rapid technique for the direct metallization of PDMS substrates for flexible and stretchable electronics applications. Microelectronic Engineering. 35-40 209
2019. Direct metallisation of polyetherimide substrates by activation with different metals. Surface and Coatings Technology. 285-296 360
2019. A review of aerosol jet printing—a non-traditional hybrid process for micro-manufacturing. International Journal of Advanced Manufacturing Technology. 4599-4619 105.11
2019. Selective Metallization of 3D Printable Thermoplastic Polyurethanes. IEEE Access. 104947-104955 7
2019. Hybrid additive manufacturing of precision engineered ceramic components. Rapid Prototyping Journal. 1061-1068 25.6
2019. Extreme environment interconnects and packaging for power electronics. Journal of Engineering. 4226-4230 2019.17
2019. Selective Electroless Copper Deposition by Using Photolithographic Polymer/Ag Nanocomposite. IEEE Transactions on Electron Devices. 1843-1848 66.4
2019. A rapid technique for the direct metallization of PDMS substrates for flexible and stretchable electronics applications. Microelectronic Engineering. 35-40 209
2019. Direct metallisation of polyetherimide substrates by activation with different metals. Surface and Coatings Technology. 285-296 360
2019. Additive manufacturing of glass with laser powder bed fusion. Journal of the American Ceramic Society. 4410-4414 102.8
2019. Rheological Tunability of Perovskite Precursor Solutions: From Spin Coating to Inkjet Printing Process. Nanomaterials. 9.4
2019. Dynamics of water evaporation from porous asphalt. Construction and Building Materials. 406-414 202
2019. Remotely Controlled in Situ Growth of Silver Microwires Forming Bioelectronic Interfaces. ACS Applied Materials & Interfaces. 8928-8936 11.9
2019. Reactive material jetting of polyimide insulators for complex circuit board design. Additive Manufacturing. 477-484 25
2019. Nanoscale Visualization and Multiscale Electrochemical Analysis of Conductive Polymer Electrodes. ACS Nano. 13(11), pp. 13271-13284
2019. An Electrode Design Rule for Organic Photovoltaics Elucidated Using a Low Surface Area Electrode. Advanced Functional Materials. 29(44), pp. 1904749-1904749
2019. Electromechanical enhancement of metal nanoparticle thin film by composite formation with short metal nanowires. Functional Composites and Structures. 1(3), pp. 035006-035006
2019. Highly Efficient (>10%) Flexible Organic Solar Cells on PEDOT‐Free and ITO‐Free Transparent Electrodes. Advanced Materials. 31(36), pp. 1902447-1902447
2019. Stabilizing Silver Window Electrodes for Organic Photovoltaics Using a Mercaptosilane Monolayer. ACS Applied Energy Materials. 2(7), pp. 5198-5205
2018
2018. Optimized vascular network by stereolithography for tissue engineered skin. International Journal of Bioprinting. 4.2
2018. Ultrasonic Additive Manufacturing as a form-then-bond process for embedding electronic circuitry into a metal matrix. Journal of Manufacturing Processes. 664-675 32
2018. Micro electronic systems via multifunctional additive manufacturing. Rapid Prototyping Journal. 752-763 24.4
2018. A Rapid Photopatterning Method for Selective Plating of 2D and 3D Microcircuitry on Polyetherimide. Advanced Functional Materials. 28.6
2018. Enabling internal electronic circuitry within additively manufactured metal structures - The effect and importance of inter-laminar topography. Rapid Prototyping Journal. 204-213 24.1
2018. Optimisation of Substrate Angles for Multi-material and Multi-functional Inkjet Printing. Scientific Reports. 8
2018. 3D-printed components for quantum devices. Scientific Reports. 8.1
2018. 3-Dimensional inkjet printing of macro structures from silver nanoparticles. Materials & Design. 81-88 139
2018. Elucidating the Exceptional Passivation Effect of 0.8 nm Evaporated Aluminium on Transparent Copper Films. Frontiers in Materials. 5
2018. Fabrication of Copper Window Electrodes with ≈108Apertures cm−2for Organic Photovoltaics. Advanced Functional Materials. 28(36), pp. 1802893-1802893
2017
2017. New concept to aid efficient fibre integration into metal matrices during ultrasonic consolidation. Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture. 1105-1115 231.7
2017. Multifunctional metal matrix composites with embedded printed electrical materials fabricated by Ultrasonic Additive Manufacturing. Composites Part B: Engineering. 342-354 113
2017. Assessing extraterrestrial regolith material simulants for in-situ resource utilization based 3D printing. Applied Materials Today. 54-61 6
2017. Towards Additive Manufacture of Next Generation Prosthetics, Assessing Emerging CAD Strategies for Improving the Existing CAD Process. International Journal of Rapid Manufacturing. 185-196 6.2/3
2017. 3D printed fluidics with embedded analytic functionality for automated reaction optimisation. Beilstein Journal of Organic Chemistry. 111-119 13
2017. 3D Inkjet Printing of Electronics Using UV Conversion. Advanced Materials Technologies. 2.10
2017. 3D inkjet printing of tablets exploiting bespoke complex geometries for controlled and tuneable drug release. Journal of Controlled Release. 207-215 261
2017. A Tripropylene Glycol Diacrylate-based Polymeric Support Ink for Material Jetting. Additive Manufacturing. 153-161 16
2017. Combined Inkjet Printing and Infrared Sintering of Silver Nanoparticles using a Swathe-by-Swathe and Layer-by-Layer Approach for 3-Dimensional Structures. ACS Applied Materials & Interfaces. 6560-6570 9.7
2017. 3D inkjet-printed UV-curable inks for multi-functional electromagnetic applications. Additive Manufacturing. 143-148 13
2016
2016. Customisable 3D printed microfluidics for integrated analysis and optimisation. Lab on a Chip. 3362-3373 16.17
2016. Engineering design of artificial vascular junctions for 3D printing.. Biofabrication. 8.2
2016. Additive manufacturing of physical assets by using ceramic multicomponent extra-terrestrial materials. Additive Manufacturing. 36-42 10
2016. Hybrid additive manufacturing of 3D electronic systems. Journal of Micromechanics and Microengineering. 26.10
2016. Integration of additive manufacturing and inkjet printed electronics: a potential route to parts with embedded multifunctionality. Manufacturing Review. 3
2016. Dynamically controlled deposition of colloidal nanoparticles suspension in evaporating drops using laser radiation. Soft Matter. 4530-4536 12.20
2016. Laser textured surface gradients. Applied Surface Science. 583-589 371
2016. Laser textured superhydrophobic surfaces and their applications for homogeneous spot deposition. Applied Surface Science. 153-159 365
2016. Inkjet printing of polyimide insulators for the 3D printing of dielectric materials for microelectronic applications. Journal of Applied Polymer Science. 133.18
2016. A Flexible and Robust Transparent Conducting Electrode Platform Using an Electroplated Silver Grid/Surface-Embedded Silver Nanowire Hybrid Structure. ACS Applied Materials & Interfaces. 8(40), pp. 27035-27043
2016. Hybrid crystalline-ITO/metal nanowire mesh transparent electrodes and their application for highly flexible perovskite solar cells. NPG Asia Materials. 8(6), pp. e282-e282
2016. Self-Supplied Nano-Fusing and Transferring Metal Nanostructures via Surface Oxide Reduction. ACS Applied Materials & Interfaces. 8(2), pp. 1112-1119
2015
2015. Solid-state additive manufacturing for metallized optical fiber integration. Composites Part A: Applied Science and Manufacturing. 181-193 76
2015. Exploring the mechanical strength of additively manufactured metal structures with embedded electrical materials. Materials Science and Engineering: A. 474-481 639
2015. Design of bifurcation junctions in artificial vascular vessels additively manufactured for skin tissue engineering. Journal of Visual Languages & Computing. 238-249 28
Masurtschak S, Friel RJ, Gillner A, Ryll J, Harris RA. 2015. Laser-Machined Microchannel Effect on Microstructure and Oxide Formation of an Ultrasonically Processed Aluminum Alloy. Journal of Engineering Materials and Technology. 137(1)
2015. Nanosecond laser textured superhydrophobic metallic surfaces and their chemical sensing applications. Applied Surface Science. 248-254 357
2014
2014. Additively manufactured heterogeneous substrates for three-dimensional control of local permittivity. Electronics Letters. 745-746 50.10
2014. Statistical analysis of stencil technology for wafer-level bumping. Soldering & Surface Mount Technology. 71-78 26.2
2014. Flexible Transparent Conducting Hybrid Film Using a Surface-Embedded Copper Nanowire Network: A Highly Oxidation-Resistant Copper Nanowire Electrode for Flexible Optoelectronics. ACS Nano. 8(10), pp. 10973-10979
2014. Bio-Inspired Dielectric Elastomer Actuator with AgNWs Coated on Carbon Black Electrode. Journal of Nanoscience and Nanotechnology. 14(10), pp. 7483-7487
2014. Ag@Ni Core-Shell Nanowire Network for Robust Transparent Electrodes Against Oxidation and Sulfurization. Small. , pp. n/a-n/a
2014. Flexible transparent conducting composite films using a monolithically embedded AgNW electrode with robust performance stability. Nanoscale. 6(2), pp. 711-715
2013
2013. Fiber laser induced surface modification/manipulation of an ultrasonically consolidated metal matrix. Journal of Materials Processing Technology. 1792-1800 213.10
2013. Microstructure formation in a thick polymer by electrostatic-induced lithography. Journal of Micromechanics and Microengineering. 035018-035018 23.3
2013. Efficient Welding of Silver Nanowire Networks without Post-Processing. Small. 9(17), pp. 2887-2894
2013. Probing polarization modes of Ag nanowires with hot electron detection on Au/TiO2 nanodiodes. Applied Physics Letters. 102(12), pp. 123112-123112
2013. High-performance hybrid plastic films: a robust electrode platform for thin-film optoelectronics. Energy & Environmental Science. 6(6), pp. 1811-1811
2012
2012. Three-Dimensional Printing (3DP) of neonatal head phantom for ultrasound: Thermocouple embedding and simulation of bone. Medical Engineering & Physics. 929-937 34.7
2012. The effects and interactions of fabrication parameters on the properties of selective laser sintered hydroxyapatite polyamide composite biomaterials. Rapid Prototyping Journal. 16-27 18.1
2012. Novel patterning technologies for ceramic MEMS. Advancing Microelectronics. 18-22 39.2
2012. A review of stencil printing for microelectronic packaging. Soldering & Surface Mount Technology. 38-50 24.1
2012. On the Use of Silver Nanoparticles for Direct Micropatterning on Polyimide Substrates. IEEE Transactions on Nanotechnology. 139-147 11.1
2012. The direct writing and focusing of nanoparticles generated by an electrical discharge. Journal of Nanoparticle Research. 14.11
2012. Fabrication of nanoscale glass fibers by electrospinning. Applied Physics Letters. 063114-063114 100.6
2011
2011. Non‐destructive analysis (NDA) of external and internal structures in 3DP. Rapid Prototyping Journal. 128-137 17.2
2011. Progress towards the design and numerical analysis of a 3D microchannel biochip separator. International Journal for Numerical Methods in Biomedical Engineering. 1771-1792 27.11
2011. Electrodeposition of copper into PCB vias under megasonic agitation.
2011. Texturing of Ga-Doped ZnO Transparent Electrode for a-Si:H Thin Film Solar Cells. Electrochemical and Solid-State Letters. 14(11), pp. B124-B124
2010
2010. The effect of interface topography for Ultrasonic Consolidation of aluminium. Materials Science and Engineering: A. 4474-4483 527.16-17
2010. A nanometre-scale fibre-to-matrix interface characterization of an ultrasonically consolidated metal matrix composite. Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications. 31-40 224.1
2010. High-Performance Transparent Conducting Ga-Doped ZnO Films Deposited by RF Magnetron Sputter Deposition. Japanese Journal of Applied Physics. 49(4), pp. 04DP09-04DP09
2009
2009. Advanced computer-aided design for bone tissue-engineering scaffolds. Proceedings of the Institution of Mechanical Engineers, Part H: Journal of Engineering in Medicine. 289-301 223.3
2009. Rapid manufacturing of bioceramic/polymer composite implants by selective laser sintering. International Journal of Computer Applications in Technology. 25-25 36.1
2008
2008. Characterization and dynamic mechanical analysis of selective laser sintered hydroxyapatite‐filled polymeric composites. Journal of Biomedical Materials Research Part A. 607-616 86A.3
2007
2007. Fabrication of porous bioactive structures using the selective laser sintering technique. Proceedings of the Institution of Mechanical Engineers, Part H: Journal of Engineering in Medicine. 873-886 221.8
2007. Ultra-Fine Pitch Stencil Printing for a Low Cost and Low Temperature Flip-Chip Assembly Process. IEEE Transactions on Components and Packaging Technologies. 129-136 30.1
2007. Computational modelling for reliable flip-chip packaging at sub-100μm pitch using isotropic conductive adhesives. Microelectronics Reliability. 132-141 47.1
2006
2006. Layer Manufacturing for in Vivo Devices. Proceedings of the Institution of Mechanical Engineers, Part H: Journal of Engineering in Medicine. 505-520 220.4
2006. Selective Laser Sintering of Hydroxyapatite Reinforced Polyethylene Composites for Bioactive Implants and Tissue Scaffold Development. Proceedings of the Institution of Mechanical Engineers, Part H: Journal of Engineering in Medicine. 521-531 220.4
2006. Step by step: STEP 4: Printing. SMT Surface Mount Technology Magazine. 20.4
2006. Stencil printing technology for fine pitch deposition of Pb-free flip chip interconnects. IMAPS Device Packaging Conference.
2006. Latest technological advancements in stencil printing processes for Ultra-fine-pitch flip chip bumping down to 60μm pitch. Proceedings of IMAPS International Conference, San Diego, CA, USA, March.
2006. Step-by-Step-Step 4: Printing-Consumer need for electronic devices drives the industry to products that are smarter, more portable, highly functional, and cost-effective. One technology helping. SMT-Surface Mount Technology-Tulsa. 41-43 20
2005
2005. Application of rapid manufacturing techniques in support of maxillofacial treatment: Evidence of the requirements of clinical applications. Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture. 469-475 219.6
2004
2004. Materials analysis of stereolithography resins for use in Rapid Manufacturing. Journal of Materials Science. 2457-2464 39.7
2004. Assembly and reliability of isotropic conductive adhesives for fine pitch flip-chip applications.
Stencil printing at sub-100 microns pitch. 6th Electronics Packaging Technology Conference (EPTC 2004)
2003
2003. Crystallinity control in parts produced from stereolithography injection mould tooling. Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications. 269-276 217.4
2003. Low temperature flip-chip packaging based on stencil printing technology. Proceedings of the IMAPS MicroTech Conference, Ettington Chase, UK, available at: www.microstencil.com/pdf/MicrotechUK_2003.pdf
Conference papers
2022
Tinsley L, Harris R. 2022. Fabricating dielectric elastomer transducer electrodes using micro atmospheric plasma jet. SPIE Smart Structures + Nondestructive Evaluation : Electroactive Polymer Actuators and Devices (EAPAD) XXIV Electroactive Polymer Actuators and Devices (EAPAD) XXIV SPIE 12042
2021
Dunn A, Zhang Z, Horbury MD, Nuttall E, Han Y, et al., 2021 46th International Conference on Infrared, Millimeter and Terahertz Waves (IRMMW-THz), 2021 Development of Advanced Terahertz Optics Using Liquid Crystals
2020
2020. 3D-printed Metasurfaces of Capped Helices Providing Broadband Negative Mode Index. 2020 Fourteenth International Congress on Artificial Materials for Novel Wave Phenomena (Metamaterials)
2019
2019. Technique for processing of continuous carbon fibre reinforced peek for fused filament fabrication. Solid Freeform Fabrication 2019
2019. Aerosol Jet Printing for the Manufacture of Soft Robotic Devices. Robosoft 2019
2019. PEI/Ag as an Optical Gas Nano-Sensor for Intelligent Food Packaging. IEEE-NANO 2018: IEEE 18th International Conference on Nanotechnology
2018
2018. Digitally-Driven Hybrid Manufacture of Ceramic Thick-Film Substrates. The Electronics System-Integration Technology Conference
2018. Digitally-Driven Micro Surface Patterning by Hybrid Manufacturing. Solid Freeform Fabrication
2018. A New Digitally Driven Process for the Fabrication of Integrated Flex-Rigid Electronics. Solid Freeform Fabrication 2018
2018. A digitally-driven Hybrid Manufacturing process for the flexible production of engineering ceramic components. Solid Freeform Fabrication 2018
2018. Hybrid Additive Manufacture of Conformal Antennas. IMWS-AMP 2018
2018. Digitally-Driven Hybrid Manufacture of Ceramic Thick-Film Substrates. The Electronics System-Integration Technology Conference
2018. Digitally-Driven Micro Surface Patterning by Hybrid Manufacturing. Solid Freeform Fabrication
2018. A New Digitally Driven Process for the Fabrication of Integrated Flex-Rigid Electronics. Solid Freeform Fabrication 2018
2018. A digitally-driven Hybrid Manufacturing process for the flexible production of engineering ceramic components. Solid Freeform Fabrication 2018
2018. Hybrid Additive Manufacture of Conformal Antennas. IMWS-AMP 2018
Saleh E; Malas A; Ashcroft I; Tuck C; Goodridge R (2018) Inkjet Printing of Electrically Induced Metal-Polymeric Actuators Materials Science & Technology (MS&T) 2018. Ohio, USA
Saleh E (2018) 3D Printing – A Pathway for Innovation (Invited Talk) CoInnovate 2018 - Cardiff. Cardiff - UK
2018. Electroplated metal grid/surface-embedded silver nanowire hybrid structure: A robust and flexible transparent conducting electrode platform. 23rd International Display Workshops in conjunction with Asia Display, IDW/AD 2016 4, pp. 2145-2148
2017
2017. New concept to aid efficient fibre integration into metal matrices during ultrasonic consolidation. Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture. 1105-1115 231.7
2017. Multifunctional metal matrix composites with embedded printed electrical materials fabricated by Ultrasonic Additive Manufacturing. Composites Part B: Engineering. 342-354 113
2017. Assessing extraterrestrial regolith material simulants for in-situ resource utilization based 3D printing. Applied Materials Today. 54-61 6
2017. Towards Additive Manufacture of Next Generation Prosthetics, Assessing Emerging CAD Strategies for Improving the Existing CAD Process. International Journal of Rapid Manufacturing. 185-196 6.2/3
2017. 3D printed fluidics with embedded analytic functionality for automated reaction optimisation. Beilstein Journal of Organic Chemistry. 111-119 13
2017. 3D Inkjet Printing of Electronics Using UV Conversion. Advanced Materials Technologies. 2.10
2017. 3D inkjet printing of tablets exploiting bespoke complex geometries for controlled and tuneable drug release. Journal of Controlled Release. 207-215 261
2017. A Tripropylene Glycol Diacrylate-based Polymeric Support Ink for Material Jetting. Additive Manufacturing. 153-161 16
2017. Combined Inkjet Printing and Infrared Sintering of Silver Nanoparticles using a Swathe-by-Swathe and Layer-by-Layer Approach for 3-Dimensional Structures. ACS Applied Materials & Interfaces. 6560-6570 9.7
2017. 3D inkjet-printed UV-curable inks for multi-functional electromagnetic applications. Additive Manufacturing. 143-148 13
2017. 3D inkjet printing of digital composites for tailored dielectric properties. 25th International Conference on Composites/Nano Engineering (ICCE-25)
2016
2016. Artificial Vascular Bifurcations – Design and Modelling. The Second CIRP Conference on Biomanufacturing
2016. Additive Manufacturing of High Resolution Embedded Electronic Systems. Solid Freeform Fabrication 2016 (SFF Symp 2016)
2016. Enabling Rapid Production and Mass Customisation of Electronics Using Digitally Driven Hybrid Additive Manufacturing Techniques. 66th Electronic Components and Technology Conference (ECTC 2016)
2016. Inkjet Printing of Three Dimensional Structures Using Metal Nanoparticles. Material Science & Technology conference MS&T – Utah-USA
Bournias-Varotsis A, Friel RJ, Harris RA, Engstrom D. 2016. Selectively anodised aluminium foils as an insulating layer for embedding electronic circuitry in a metal matrix via ultrasonic additive manufacturing. Proceedings of the 27th Annual International Solid Freeform Fabrication Symposium - An Additive Manufacturing Conference, SFF 2016. 2260-2270.
Goulas A, Southcott-Engstrøm D, Friel RJ, Harris RA. 2016. Investigating the additive manufacture of extra-terrestrial materials. Proceedings of the 27th Annual International Solid Freeform Fabrication Symposium - An Additive Manufacturing Conference, SFF 2016, 2260-2270
2015
2015. The Effect of Ultrasonic Excitation on the Electrical Properties and Microstructure of Printed Electronic Conductive Inks. 2015 38th International Spring Seminar on Electronics Technology (ISSE)
2015. Tattoo Antenna Temporary Transfers Operating On-Skin (TATTOOS). DUXU 2015: 4th International Conference of Design, User Experience, and Usability
2015. 3D inkjet printing of conductive structures using in-situ IR sintering. 26th Annual International Solid Freeform Fabrication Symposium
2015. 3D-inkjet Printing of Flexible and Stretchable Electronics. Annual International Solid Freeform Fabrication Symposium – Texas-USA
2015. The Optimization of Conductive Inks for 3D Inkjet Printing. NIP 30
2014
2014. Characterization of Cu-Sn SLID interconnects for harsh environment applications. DTIP 2014
2014. 3D inkjet-printed UV-curable inks for multi-functional electromagnetic applications. ISCIE/ASME 2014 International Symposium on Flexible Automation (ISFA2014)
2014. Investigation on the performance of multi-layer printed conductive tracks on multi-layer printed insulator. Annual International Solid Freeform Fabrication Symposium – Texas-USA
Li J, Monaghan T, Bournias-Varotsis A, Masurtschak S, Friel RJ, Harris RA. 2014. Exploring the mechanical performance and material structures of integrated electrical circuits within solid state metal additive manufacturing matrices. The Twenty-Fifth Annual International Solid Freeform Fabrication (SFF) Symposium – An Additive Manufacturing Conference The Twenty-Fifth Annual International Solid Freeform Fabrication (SFF) Symposium – An Additive Manufacturing Conference University of Texas at Austin, pp. 857-864
2013
2013. Ultrasonic Additive Manufacturing – A Hybrid Production Process for Novel Functional Products. Procedia CIRP
2013. Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation. Microsystem Technologies
2013. Fabrication of a low temperature co-fired ceramic package using powder blasting technology. Microsystem Technologies
2013. Lamination based embossing technique for LTCC. Microsystem Technologies
2013. Evaluating trends and implications of Rapid Prototyping and Additive Manufacture - Opening Keynote Speech. Rapid Prototyping Conference
2012
2012. Ultrasonic additive manufacturing research at loughborough university. 23rd Annual International Solid Freeform Fabrication Symposium - An Additive Manufacturing Conference, SFF 2012
2012. Electrochemical deposition of Galfenol. 2012 14th International Conference on Electronic Materials and Packaging (EMAP)
2012. Simultaneously printing the redistribution layer and filling of TSVs using a microengineered screen. 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012)
2012. Progress towards filling through silicon vias with conductive ink. 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012)
2012. Stencil technology for wafer level bumping. 2012 4th Electronic System-Integration Technology Conference (ESTC)
2012. Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation. 2012 SYMPOSIUM ON DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS (DTIP)
2012. LTCC Package Manufacturing Using Powder Blasting Technology. 2012 SYMPOSIUM ON DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS (DTIP)
2011
2011. The effect of electro-discharge machined sonotrode topology on interlaminar bonding in ultrasonic consolidation. SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring
2011. Enabling techniques for secure fibre positioning in ultrasonic consolidation for the production of smart material structures. SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring
2011. Building and assessing anatomically relevant phantoms for neonatal transcranial ultrasound. Journal of Physics: Conference Series
2011. Optimization and characterization of Drop-on-Demand inkjet printing process for platinum organometallic inks. 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011)
2011. Novel dual layer electroformed stencils for high resolution LTCC circuit manufacture. 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011)
2011. Meso-scale actuator design for the integrated dynamic alignment of a lenslet array within a package. DTIP 2011 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
2011. Design, manufacturing and packaging of high frequency micro ultrasonic transducers for medical applications. 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011)
2011. Innovative manufacturing and 3-dimensional packaging methods of micro ultrasonic transducers for medical applications. EMPC-2011 - 18th European Microelectronics and Packaging Conference, Proceedings
2011. Characterisation of ion transportation during electroplating of high aspect ratio microvias using megasonic agitation. EMPC-2011: 18TH EUROPEAN MICROELECTRONICS & PACKAGING CONFERENCE
2011. Manufacture of a 3-D Package Using Low Temperature Co-fired Ceramic Technology. EMPC-2011: 18TH EUROPEAN MICROELECTRONICS & PACKAGING CONFERENCE
Johnson K, Edmonds HC, Higginson RL, Harris R. 2011. New discoveries in ultrasonic consolidation nano-structures using emerging analysis techniques. Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications SAGE
2010
2010. Enabling dissimilar fibre embedding and explicit fibre layout in ultrasonic consolidation. 21st International Conference on Adaptive Structures and Technologies 2010, ICAST 2010
2010. Effect of rf-power density on the resistivity of Ga-doped ZnO film deposited by rf-magnetron sputter deposition technique. Current Applied Physics Elsevier BV 10(3), pp. S451-S454
Gatto M, Harris R, Sama A, Watson J. 2010. Investigating the effectiveness of three-dimensional-printing for producing realistic physical surgical training phantoms. Annals of DAAAM for 2010 and 21st International DAAAM Symposium "Intelligent Manufacturing and Automation: Focus on Interdisciplinary Solutions" Annals of DAAAM and Proceedings of the International DAAAM Symposium Elsevier
2009
Radley GJ, Sama A, Watson J, Harris R. 2009. Characterization, quantification, and replication of human sinus bone for surgery simulation phantoms. Proceedings of the Institution of Mechanical Engineers, Part H: Journal of Engineering in Medicine Proceedings of the Institution of Mechanical Engineers, Part H: Journal of Engineering in Medicine SAGE journals
2007
2007. Automated design of tissue engineering scaffolds by advanced CAD. 18th Solid Freeform Fabrication Symposium, SFF 2007
Hao L, Savalani MM, Harris R, Zhang Y, Tanner KE. 2007. Characterisation of HA/polymer bio-composite structure fabricated by selective laser sintering. Proceedings of the 3rd International Conference on Advanced Research in Virtual and Rapid Prototyping: Virtual and Rapid Manufacturing Advanced Research Virtual and Rapid Prototyping 3rd International Conference on Advanced Research in Virtual and Rapid Prototyping: Virtual and Rapid Manufacturing Advanced Research Virtual and Rapid Prototyping unknown
2006
2006. Design, manufacture and testing of microengineered stencils used for sub 100 micron wafer level bumping. 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'06
2006. Stencil Printing Technology for Fine Pitch Deposition of Pb-Free Flipchip Interconnects. IMAPS International Conference and Exhibition on Device Packaging, Scottsdale, Arizona, USA
2006. Ultra fine pitch stencil printing using lead free solder paste. Materials Valley e.V. - Wafer Bumping Workshop, Hanau, Germany
2005
2005. Layer manufacturing of polymer/bioceramic implants for bone replacement and tissue growth. VIRTUAL MODELING AND RAPID MANUFACTURING
2005. Sub-100 micron pitch stencil printing for wafer scale bumping. 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis
2005. Sub process challenges in ultra fine pitch stencil printing of type‐6 and type‐7 Pb‐free solder pastes for flip chip assembly applications. Soldering & Surface Mount Technology
2005. Stencil printing technology for wafer level bumping at sub-100 micron pitch using Pb-free alloys. 55th Electronic Components & Technology Conference, Vols 1 and 2, 2005 Proceedings
2004
2004. Low cost Flip-chip Assembly for Microsystems. EPPIC Faraday Seminar, Flip-chips with everything, TWI, Cambridge, UK
2004. Stencil printing at less than 100 micron pitch. Sixth International Conference on Electronic Materials and Packaging
2004. Stencil Printing at sub-100 micron pitch using microengineered stencils. 4th Euspen International Conference
2003
2003. The Use of Metal Powder Binger Rapid Tooling in Metal & Polymer Small Batch Manufacturing Techniques. Proceedings of the 1st International Conference on Advanced Research in Virtual and Rapid Prototyping
Differences in the sub-processes of ultra fine pitch stencil printing due to type-6 and type-7 Pb-free solder pastes used for flip chip. 53rd Electronic Components and Technology Conference, 2003
Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. 5th Electronics Packaging Technology Conference (EPTC 2003)
2003. A High Volume, Low Cost and Low Temperature MEMS Packaging Technology Based on a Flip-Chip Assembly Process. Micro.Tec
Harris R, Dickens PM. 2003. Determining, understanding & controlling the morphology of injection moulded parts produced in stereolithography moulds. Annual Technical Conference - ANTEC, Conference Proceedings Annual Technical Conference - ANTEC, Conference Proceedings unknown
2002
Harris R. 2002. Selection of mould design variables in direct stereolithography injection mould tooling. Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture SAGE journals
Book chapters
2021
Ekinci A, Han X, Bibb R, Harris R. 2021. Optimised Vascular Network for Skin Tissue Engineering by Additive Manufacturing. In: Bidanda B; Bártolo PJ (eds.) Virtual Prototyping & Bio Manufacturing in Medical Applications. Springer, Cham, pp. 1-20
2020
2020. Chapter 16 - 3D and 4D printed polymer composites for electronic applications. In: Sadasivuni KK; Deshmukh K; Almaadeed MA (eds.) 3D and 4D Printing of Polymer Nanocomposite Materials: Processes, Applications, and Challenges.
2014
2014. Electrodes in organic photovoltaic cells. In: Organic Solar Cells: Fundamentals, Devices, and Upscaling. , pp. 219-276
2011
Harris R. 2011. Injection Molding Applications. In: Bártolo PJ (eds.) Stereolithography Materials, Processes and Applications. Springer Science & Business Media
2008
Hao L, Harris R. 2008. Customised implants for bone replacement and growth. In: Bio-Materials and Prototyping Applications in Medicine. Springer US
2006
Harris R, Savalani M. 2006. Medical Applications. In: Rapid Manufacturing: An Industrial Revolution for the Digital Age. John Wiley & Sons, Ltd
2004
2004. The world of electronic packaging and system integration : anniversary edition, 60th birthday of Herbert Reichl. Invited chapter titled, "Stencil printing at less than 100 microns’.
Videos
2019
2019 Animated 3D CAD rendering video of the machine designed and built to achieve the research published in the paper titled: "Hybrid additive manufacturing of precision engineered ceramic components" Rapid Prototyping Journal (2019), Vol. 25 No. 6, pp. 1061-1068.
Patents
2004. Stencil manufacture. 31 Jan 2003
Other
2018
Saleh E; Malas A; Ashcroft I; Tuck C; Goodridge R (2018) Inkjet Printing of Electrically Induced Metal-Polymeric Actuators Materials Science & Technology (MS&T) 2018. Ohio, USA
Saleh E (2018) 3D Printing – A Pathway for Innovation (Invited Talk) CoInnovate 2018 - Cardiff. Cardiff - UK
2017
Saleh E (2017) From inks to functional devices, the journey to 3D-print multi-materials (Invited Talk) IEEE Workshop on Functional 3D Additive Manufacturing. Tokyo-Japan
Saleh E (2017) Current technologies and advances in additive manufacturing (Invited speaker) Applications of 3D printing for medical phantoms. National Physical Laboratory, Teddington-UK
2004
Norwood AJ, Dickens PM, Soar RC, Harris R, Gibbons G, Hansell R. 2004. Analysis of cooling channels performance.
2004. Stencil manufacture